Durn-Yuan Hwang: search on Z-Library

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1

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Warpage simulations with P-V-T-C equation and experiments of fan-out wafer level package after encapsulation process

Deng, Shang-Shiuan, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan, Shen, Geng-Shin

Year:

2010

Language:

english

File:

PDF, 169 KB

english, 2010

2

Study of P-V-T-C Relation of EMC

Chang, Yi-San, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan

Journal:

Journal of Electronic Packaging

Year:

2002

Language:

english

File:

PDF, 155 KB

english, 2002

3

Volume Shrinkage Characterization of Underfill Materials

Shang-Shiuan Deng, Chia-Yi Ho, Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Hwang

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 694 KB

english, 2011

4

Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing

Yeong-Jyh Lin, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 433 KB

english, 2011

5

Prediction of paddle shift via 3-D TSOP modeling

Durn-Yuan Huang,, Huei-Huang Lee,, Sheng-Jye Hwang,, Su, F.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2000

Language:

english

File:

PDF, 379 KB

english, 2000

6

[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Post-mold cure process simulation of IC packaging

Chi-Hong Shue,, Sheng-Jye Hwang,, Huei-Huang Lee,, Durn-Yuan Huang,, Yao-Jung Lee,

Year:

2008

Language:

english

File:

PDF, 4.96 MB

english, 2008

7

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - On mold corner effects of EMC adhesion for IC encapsulation process

Yeh, Chia-Hsun, Deng, Chen-hung, Lee, Huei-Huang, Hwang, Sheng-Jye, Huang, Durn-Yuan

Year:

2011

Language:

english

File:

PDF, 789 KB

english, 2011

8

Development of an external-type microinjection molding module for thermoplastic polymer

Pei-Chi Chang, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang

Journal:

Journal of Materials Processing Technology

Year:

2007

Language:

english

File:

PDF, 1.46 MB

english, 2007

9

[IEEE 2006 International Conference on Electronic Materials and Packaging - Kowloon, China (2006.12.11-2006.12.14)] 2006 International Conference on Electronic Materials and Packaging - Prediction of Process Induced Warpage of Electronic Package by P-V-T-C Equation and Taguchi Method

Chen, Jian-Yu, Teng, Shiang-Yu, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan

Year:

2006

Language:

english

File:

PDF, 1.51 MB

english, 2006

10

[IEEE 2002 8th International Advanced Packaging Materials Symposium - Stone Mountain, GA, USA (3-6 March 2002)] 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) - Wire density effect on wire sweep analysis for IC packaging

Chien-Chang Pei,, Su, F., Sheng-Jye Hwang,, Durn-Yuan Huang,, Huei-Huang Lee,

Year:

2002

Language:

english

File:

PDF, 292 KB

english, 2002

11

[IEEE 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. - Portland, OR, USA (12-15 Sept. 2004)] 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. - Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging

Li-Ching Hong,, Sheng-Jye Hwang,, Huei-Huang Lee,, Durn-Yuan Huang,

Year:

2004

Language:

english

File:

PDF, 428 KB

english, 2004

12

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Simulation and experiments of fan-out wafer level package during encapsulation

Shang-Shiuan Deng,, Sheng-Jye Hwang,, Huei-Huang Lee,, Durn-Yuan Huang,, Yu-Ren Chen,, Geng-Shin Shen,

Year:

2009

Language:

english

File:

PDF, 1.43 MB

english, 2009

13

Effects of defrosting period on mold adhesion force of epoxy molding compound

Hwe-Zhong Chen, Wen-Hung Lee, Huei-Huang Lee, Durn-Yuan Huang, Shyang-Jye Chang, Sheng-Jye Hwang

Journal:

Asia-Pacific Journal of Chemical Engineering

Year:

2009

Language:

english

File:

PDF, 397 KB

english, 2009

14

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Molded underfill for flip chip package

Chen, Yu-Kai, Wu, Guo-Tsai, Hwang, Sheng-Jye, Lee, Huei-Huang, Hwang, Durn-Yuan

Year:

2013

Language:

english

File:

PDF, 1.21 MB

english, 2013

15

[ASME ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME 2007 InterPACK Conference, Volume 1 - Mold Adhesion Force Measurement

Lee, Huei-Huang, Hwang, Sheng-Jye, Huang, Durn-Yuan, Lin, Yeong-Jyh

Year:

2007

Language:

english

File:

PDF, 862 KB

english, 2007

16

Consideration of different heating lengths of needles with induction heating and resistance system: A novel design of needle module for thermal ablation

Bui, Huy-Tien, Hwang, Sheng-Jye, Lee, Huei-Huang, Huang, Durn-Yuan

Journal:

Bioelectromagnetics

Year:

2017

Language:

english

File:

PDF, 1.28 MB

english, 2017

17

[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 1 - Copper Plating Process for Through Silicon Via With High Aspect Ratio in Advanced Packaging

Huang, Yu Hung, Lee, Huei-Huang, Hwang, Sheng-Jye, Huang, Durn-Yuan

Year:

2009

Language:

english

File:

PDF, 572 KB

english, 2009

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